Layer count | 1-18 layers |
Material | fr4,Tg=135,150,170,180,210,cem-3,cem-1,al base,teflon,rogers,nelco |
Copper thickness | 1/2oz,1oz,2oz,3oz,4oz,5oz |
Board thickness | 8-236mil(0.2-6.0mm) |
Min.line width/space | 3/3 mil(75/75um) |
Min. drill size | 8 mil(0.2mm) |
Min. HDI laser drill size | 3 mil(0.067mm) |
Tolerance of hole size | 2 mil(0.05mm) |
PTH copper thickness | 1 mil(25 um) |
Solder mask color | Green,blue,yellow,white,black,red |
Peelable solder mask | Yes |
surface treating | HASL(ROHS), ENING,OSP,IMMERSION SILVER,IMMERSION TIN,flash gold |
Gold thickness | 2-30u" (0.05-0.76um) |
Blind hole/buried hole | Yes |
V-cut | Yes |
Technology | SMT, THT |
SMT capability | 2,000,000 points per day |
DIP capability | 300,000 points per day |
Experiences | QFP, BGA, μBGA, CBGA |
Process | Lead-free |
Programming | Yes |
Conformal coating | Yes |
Q. What service can you supply ?
ZYX are OEM PCB and PCBA manufacturer since 2010 ,we can provide
turnkey solutionincluding RD PCB fabrication,SMT and assembly PCBA
inside the enclosure,Functiontesting and other value-added service.
Q. What file you need to prepare if you want to get an quotation
from us?
For PCB board, you need to prepare files of Gerber file,it should
including RS-274X,ODB++, DXF, PCB, PCBDOC etc formats.
For PCBA(PCB with soldered components), except the file for PCB,
you also need to prepare the BOM list (components list), Pick and
Place file(txt format), real sample pictureor 3D PDF version file
etc.
Q. Do you have any MOQ Limited ?
We havent any limited about MOQ .Sample and mass production all can
support.
Q. How to keep our product information and design file secret ?
We are willing to sign a NDA effect by customers side local law and
promising tokeep customers data in high confidential level.
Silkscreen color:
Q. How can we guarantee you receive an good quality product?
For PCB, we will use Flying Probe Test, E-test etc. for it.
For PCBA, we need you to offer us a method or test fixture for the
function test.Before that, our inspectors will use microscope and
X-ray to check the IC footwelding or bad solder etc.
